| Part |
Width |
Height |
Type |
Attachment |
1m/s |
2m/s |
3m/s |
Natural Convection |
|
| Dimensions (MM) |
Thermal Resistance THETA-SA (°C/W) |
| BTM-B01208BPNN |
11.8 |
8 |
Plate Fin |
|
35.67 |
23.94 |
19.07 |
67  |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B01410BCNN |
14 |
10 |
Cross Cut |
|
17.38 |
11.57 |
9.19 |
49.38 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B01911BPNN |
19 |
11.1 |
Plate Fin |
|
9.35 |
7.08 |
6.16 |
31.269 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B02306BCNN |
23 |
6 |
Cross Cut |
|
11.65 |
7.37 |
5.71 |
33.222 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B02310BCNN |
23 |
10 |
Cross Cut |
|
7.72 |
4.94 |
3.88 |
25.330 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B02311BPNN |
23 |
11 |
Plate Fin |
|
7.41 |
5.56 |
4.82 |
25.865 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B02424BPNN |
24.1 |
23.7 |
Plate Fin |
|
7.35 |
5 |
4.01 |
20.83 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B02711BPNN |
27 |
11.1 |
Plate Fin |
|
5.40 |
3.93 |
3.36 |
23.747 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B02815BCNN |
27.9 |
15.2 |
Cross Cut |
|
4.89 |
3.68 |
3.16 |
17.14 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B02815BPNN |
28.1 |
15.2 |
Plate Fin |
|
4.51 |
2.98 |
2.38 |
21.37 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B03106BCNN |
31 |
6 |
Cross Cut |
|
7.05 |
4.28 |
3.25 |
17.916 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B03110BCNN |
31 |
10 |
Cross Cut |
|
4.51 |
2.78 |
2.12 |
13.637 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B03111BPNN |
31 |
11.1 |
Plate Fin |
|
4.56 |
3.27 |
2.78 |
20.941 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B03123BPNN |
30.5 |
22.9 |
Plate Fin |
|
3.37 |
2.55 |
2.15 |
18.363 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B03511BPNN |
35 |
11.1 |
Plate Fin |
|
36.5 |
2.55 |
2.14 |
19.916 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B03603720BPNN |
36.8 |
20.3 |
Plate Fin |
|
2.91 |
2.22 |
1.93 |
15.111 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B04006BCPP |
40 |
6 |
Push Pin |
Push Pin |
5.34 |
3.21 |
2.43 |
50.18 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B04010BCNN |
40 |
10 |
Cross Cut |
|
3.24 |
1.98 |
1.51 |
9.965 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B04011BPNN |
40 |
11.1 |
Plate Fin |
|
2.8 |
1.94 |
1.62 |
8.63 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B04510BCNN |
45 |
10 |
Cross Cut |
|
2.60 |
1.53 |
1.15 |
7.852 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B04511BPNN |
45 |
11.1 |
Plate Fin |
|
2.81 |
1.95 |
1.63 |
7.74 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B04615BCNN |
46 |
15.4 |
Cross Cut |
|
2.33 |
1.48 |
1.15 |
10.166 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
| BTM-B05011BPNN |
50 |
11.1 |
Plate Fin |
|
2.38 |
1.61 |
1.33 |
14.47 |
|
Product & Service Information
Aluminum plate fin BGA heatsinks are low profile, high efficiency cooling products which are ideal for linear air flow environments. These devices mount with adheasvie tape or thermal epoxy to provide optimum cooling at a very competitive price. These off-the-shelf, high efficiency solutions are easy to install and require no special board modifications or complex assemblies.
- High thermal conductivity 6063-T5 aluminum
- Plate Fins as thin as 0.6 mm
- Finish is black anodized
- Optional adheasive tape attachment
|
|
